Dorelink
Dorelink
Founded in 2016, Dorelink Optical Communications Co., Ltd. has evolved over the past 12 years into a key driver of international optical transceiver and high-speed connector ecosystems. Operating a state-of-the-art 18,500㎡ production facility, we serve system integrators, tier-one carriers, and data center infrastructures with certified connectivity hardware.
With 7 solid years of direct export footprint spanning North America, Europe, the Middle East, and Asia, our manufacturing is rooted in rigorous compliance protocols and high-reliability design guidelines. We run 100% automated optical alignment, signal analysis, and environmental cycling tests to assure performance compatibility.
With East-West data center traffic growing exponentially, our low-latency optical transceivers and EMI-shielded cage arrays support spine-leaf topologies. These solutions assist operations scaling to 100G, 400G, and higher configurations.
Providing high-temperature stability BiDi (Bidirectional) SFP systems. These units operate on single-strand single-mode fiber, effectively doubling the physical optical footprint capacity while lowering fiber plant costs.
Ruggedized RJ45 magnetic connectors and POE (Power over Ethernet) jacks delivering up to 30W per port. Built to perform under fluctuating thermal environments and resist high EMI environments in automated factories.
Modern high-speed communications require component precision down to the sub-micron scale. China's manufacturing clusters integrate optoelectronic material engineering with high-capacity assembly systems. Dorelink's operations bridge research prototypes with global distribution.
By sourcing raw components through verified partnerships and running full SMT and optical alignment lines, we mitigate localized supply volatility. This integration ensures our partners, ranging from system integrators in North America to regional telecom operators in Europe, maintain continuous deployments.
Our export experience guides our logistics and customs procedures, ensuring that shipments of transceiver modules, magnetic RJ45 connectors, and EMI shielding cages arrive on schedule with complete certification files.
At Dorelink, reliability is verified through metric-based testing. Our quality control division, consisting of 45 professional inspectors, manages a multi-stage verification framework designed to catch anomalies before dispatch:
Compliance is critical in international infrastructure bidding. Dorelink products strictly conform to the following directives:
Optimizing thermal dissipation structure by introducing multi-fin heat sink configurations and advanced light pipe structures to handle modules up to 10W per port.
Deploying PAM4 modulation circuits, optimizing digital signal processor (DSP) firmware to achieve lower bit error rate curves under long-reach fiber configurations.
Partnering with wafer fabrication teams to design integrated optical engines, moving the optical transceiver directly to the ASIC package to reduce interconnect loss.
Our production capabilities are sustained by continuous investment in cleanroom environments, automated optical assembly benches, and reliability test systems.
Our transceivers conform strictly to the SFP MSA (Multi-Source Agreement). During manufacturing, our R&D group tests each unit against compatibility files from platforms including Cisco, Juniper, Arista, and HPE. This process ensures plug-and-play operation and prevents configuration rejections.
We provide cages equipped with custom heat sink designs (extruded, pin-fin, or plate-fin configurations) and integrated light pipes. The press-fit and through-hole pin formats are designed to optimize thermal paths and maintain component reliability in high-temperature environments.
Yes, our entire manufacturing line, including solder alloys, PCB substrates, optical housings, and connectors, is certified lead-free and free of hazardous substances in accordance with RoHS and REACH regulations. Certification documents are available upon request.
Our magnetic RJ45 connectors undergo 100% turn-ratio and polarization tests, high-pot isolation tests (minimum 1500V AC), insertion/return loss measurements, and visual inspection of EMI shielding fingers to verify ground contacts.
For custom labeling, unique firmware configuration registers, or specialized packaging layouts, the typical lead time ranges from 2 to 4 weeks depending on production volume. This timeline is supported by our 120-person R&D team and direct component sourcing.
Yes. We offer modules such as the 1550nm-TX/1310nm-RX and 1310nm-TX/1550nm-RX Simplex LC Bidi SFP, which utilize wavelength division multiplexing (WDM) to transmit and receive signals over a single strand of single-mode fiber (SMF).
